SCB and SMI: two stretchable circuit technologies, based on standard printed...
AbstractPurpose– In the past 15 years stretchable electronic circuits have emerged as a new technology in the domain of assembly, interconnections and sensor circuits and assembly technologies. In the...
View ArticleThe influence of test method, conductor profile and substrate anisotropy on...
AbstractPurpose– The purpose of this paper is to help high frequency circuit designers understand how to choose the best permittivity value for a laminate material for accurate modeling....
View ArticleA novel flip-chip interconnection process for integrated circuits
AbstractPurpose– The purpose of this paper is to present an outline of the development of a new process for the formation of flip-chip interconnections using metal coated polymer microparticles....
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